Under Development
What does the future hold for AMD based solutions? At the best of times a difficult question to answer, as the best laid plans. . . can and do change. The information we have provided is really a guideline, and should be viewed as that only. Details provided are for up to Q1 2001.

Chipsets

VIA HDIT Architecture - The HDIT Architecture provides a cost-effective yet highly flexible baseline platform that allows System OEMs to integrate such advanced features as a DDR266 memory interface, AGP4X, and VIA's new 512MB per second V-Link bus to a highly-integrated HDIT South Bridge in mainstream desktop and mobile PC designs. To ensure the scalability that System OEMs require for high-end multi-processor workstation and server designs, the memory interface and AGP port in the HDIT North Bridge can also be configured in HDIT Mode to double or even quadruple memory data bandwidth to rates as high as 4.2GB per second. (We have more information on our site - click here to view).
The planned chipsets are:

VT8367 "KX266" Northbridge - 266MHz EVA DDR FSB Official Support, PC-266 Spec, DDR 266 SDRAM Support (up to 266MHz), AGP 4x w/Fastwrites, 12.5x Multiplier Support, Socket A CPU Support, 552 Pin BGA Chip.

VT8367 "KM266" Northbridge - same as the KX266 but with Integrated Savage4 3D Video.

VT82C686B "686B" Southbridge - Dual UDMA 100/66/33 Channels, APM Super I/O with Hardware Monitoring, 4 USB, HSP Modem Support, AC-97 Audio, 352 Pin BGA Chip.

VT8233 Southbridge - Dual UDMA 100/66/33 Channels, VLINK, HPNA Support, APM Super I/O with Hardware Monitoring, IEEE 1394 Link, 6 USB, APIC, HSP Modem Support, High Performance AC-97 Audio, 352 Pin BGA Chip.

AMD are currently developing the 760 and 770 chipsets, the 760 is scheduled for Q2 2000 AMD have plans to move the Front-side Bus to 266MHz and will include support for DDR memory and AGP4x. The 770 chipset is anticipated to provide the same features as the 760 but with added SMP features (dual processor capabilities).

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