Introduction
VIA Technologies, Inc, the world's leading fabless supplier of PC core logic chipsets, microprocessors, and multimedia and communications chips, has unveiled its advanced new scaleable HDIT (High-Bandwidth Differential Interconnect) Architecture for its next generation of VIA Apollo DDR chipsets.

VIA's HDIT Architecture provides a cost-effective yet highly flexible baseline platform that allows System OEMs to integrate such advanced features as a DDR266 memory interface, AGP4X, and VIA's new 512MB per second V-Link bus to a highly-integrated HDIT South Bridge in mainstream desktop and mobile PC designs. To ensure the scalability that System OEMs require for high-end multi-processor workstation and server designs, the memory interface and AGP port in the HDIT North Bridge can also be configured in HDIT Mode to double or even quadruple memory data bandwidth to rates as high as 4.2GB per second.

"With our new HDIT architecture, VIA has once again demonstrated our growing market leadership and ability to deliver creative engineering innovation to the PC platform," commented Dr. Tzu-Mu Lin, Sr. Vice President of Engineering of VIA Technologies, Inc. "It is designed to exceed next generation high bandwidth data traffic requirements within a PC system, but still maintains a flexible system implementation that allows System OEMs to meet different performance and cost requirements in all segments of the PC market."

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