The Pentium 4 Platform

The Intel Pentium 4 is manufactured using 0.18-micron technology with Aluminium interconnects. This then is no different than the current process used to manufacture the Pentium III. Since the Pentium 4 is based on the old 0.18-micron process and yet has such a complex architecture the processor itself ends up being rather huge, with 42 million transistors, featuring a die size of 127mm^2 which in comparison to AMD is nearly twice the size and around 8 million transistors more. A new CPU means an entirely new chipset, previously only know to us as "Tehama", the i850 chipset uncovered does not seem all that new, essentially it is the same as today's i840/AGP4x chip set with support for the Pentium 4's AGTL+bus, there is no support for multiple processors.

The i850 MCH chip as illustrated in the photograph uses the flip chip package technology and requires a heat sink. As mentioned earlier due to its increased size the need for a new socket becomes necessary, the new 423-pin socket is utilised but not for long as we shall all discover shortly. All in all, there seems no reason for us to be elated by this launch, what with the Pentium 4 using the same 0.18-micron technology, being larger than its predecessor with a die size of 127mm^2, and 24 million transistors, the new i850 chipset with its features is not exactly earth shattering. So, why did Intel not come up with a new an innovative but technological more superior design? There are some issues we seem to be overlooking; firstly, we need to closely examine the Pentium 4 Micro-Architecture, which we discuss in-depth later in our review, and secondly, this is only a transition stage for Intel and the Pentium 4. Based on its Micro-Architecture Intel has sleek plans to grab the limelight in not so distant future. Let us briefly look at the future from the information we have at our disposal:

In Q3 of 2001, Intel should ship Northwood (new Pentium P4); a die shrink to 0.13-micron that may also coincide with a move over to using Copper interconnects. The most obvious twist though will be to drive its clock speed to astonishing new levels. It is not unreasonable to assume that t his processor will be able to hit or exceed 2GHz. When Northwood launches, it will retain its position at the high end when combined with Intel's Tehama platform - enhanced with the ICH3 south bridge. In addition, the Northwood die shrink will reduce costs and increase capacity, allowing expansion into the sub-£2000 mainstream when combined with the new Brookdale (ICH3+SDR/DDR) chip set supporting SDRAM. Starting in H1'02, Intel expects to fill its entire product range above £1000 with Northwood. In the generation gap between now and Northwood, Intel will introduce a package change. The initial PGA423 package for Pentium 4 is depicted here (423 pins). Prior to the introduction of Northwood, Intel will introduce the Pentium 4 in a new mPGA478 package, with 55 new additional pins. The dual package strategy for Pentium 4 is to help ease the transition to Northwood. Northwood will ship exclusively in the new mPGA478 package for the desktop market. We presume that these new additional pins are primarily for the power and ground necessary to run at 2GHz and above. Northwood platforms will also require a new on board voltage regulator solution to supply the processor with new core operating voltages at higher currents. In mid 2001, Intel will release its ICH3 chip (south bridge). The primary new feature of the ICH3 chip is the addition of USB2.0 (six ports!). Other than that, its primary features seem to be the same as the ICH2 - such as ATA100 support, integrated LAN interface, AC97 audio and modem capabilities, etc.

The ICH3 is the only point of differentiation between i850 and i850E chip sets. The north bridge is constant. Intel will use the availability of the ICH3 as an additional catalyst to justify a board redesign to migrate from the P4's 423-pin package to the 478-pin package. The ICH3 will show up first on P3 (Coppermine and Tualatin) platforms using the Almador chip set in mid Q2'01. It will be packaged in a 421 pin BGA.

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